The PRODUCT_PACKAGE_OVERLAYS mechanism seems to work with a full make or make Foo. I think this makes sense because the PRODUCT_PACKAGE_OVERLAYS are placed in the top level product makefile. But I'm wondering is there a way to point the build system to use the overlay when building a single component via mm? I have tried adding PRODUCT_PACKAGE_OVERLAYS to that components Android.mk file but no success....
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