> On Mar 27, 2019, at 06:21, Luke Kenneth Casson Leighton <[email protected]> wrote: > >> On Tue, Mar 26, 2019 at 11:52 PM David Niklas <[email protected]> wrote: >> >> On Sat, 23 Mar 2019 16:56:25 +0000 >> Luke Kenneth Casson Leighton <[email protected]> wrote: >> <snip> >>> >>> not a snowball in hell's chance. resin is too brittle, 3D printing >>> is far too inaccurate, and the plastic is extremely thin. 5 years ago >>> the ones we had stamped out for prototypes (laser-cutting i believe) >>> broke almost immediately. >>> >> >> What material did you laser cut? I would have thought that laser cut >> aluminum would be perfect. > > ten prototypes of the mass-produced PCMCIA plastic surround from > Litkconn had holes laser-cut to make space for the micro-sd, > micro-hdmi and USB-OTG ports. > > the result was plastic under 1mm deep that had only around 0.5mm > height below e.g. the micro-sd card and it of course snapped > immediately.
Sounds like a more flexible plastic is needed but that clearly impacts the manufacturing processes available and thus the cost. > as a result we considered very thin metal sheet (thick foil in > effect) that could be stamped (or laser cut) and was effectively a > "metal sticker" that could go over the end and be bent round. > probably even by hand. Did you try the foil? How well did it work? _______________________________________________ arm-netbook mailing list [email protected] http://lists.phcomp.co.uk/mailman/listinfo/arm-netbook Send large attachments to [email protected]
