> On Aug 25, 2020, at 14:57, Luke Kenneth Casson Leighton <[email protected]> wrote:
> 
> On Tuesday, August 25, 2020, Philip Hands <[email protected]> wrote:
>> 
>> It seems that is a 130nm fab, based in the USA somewhere.
> 
> yes.
> 
> it is around 25 sq mm and an 80 pin QFP fixed package.

Very nice!  That sounds really cool from the perspective of someone who got a 
big kick out of VLSI Design class but never had the budget to run a personal 
design through to packaged dies.

80 pins and 25 sq mm at 0.13μm with free digital and analog cell designs.

Now, I wonder how quickly the free toolchain will solidify?


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