Fifer;140508 Wrote: 
> Utilising the case/chassis as a heatsink is a much more elegant and
> efficient design solution compared with drilling lots of holes on the
> case which let a little heat out and a load of dust in.

yah, my x times more expensive emm labs dcc2 se has holes on the top
cover...


-- 
WSLam

WSLam
'Transporter' (http://www.slimdevices.com/) + 'SB3'
(http://www.slimdevices.com/) -> 'EMM Labs DCC2 SE'
(www.emmlabs.com/html/audio/dcc2/dcc2.html) -> 'Acoustic Reality
eAR1001' (http://www.acoustic-reality.com) -> 'Magico Mini'
(http://www.magico.net)
'Photos of Transporter, Inside & Out'
(http://photos.lam.ws/gallery/1930618) | 'Photos of my Setup'
(http://photos.lam.ws/gallery/1573984/1/87768997)
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