Erik Christiansen wrote: > One day I must try the upturned (clothes) iron method ...
I tried that. It took a really long time and I became concerned that I was reducing the strength of the bond between the copper traces and the PCB with the long hot time. It works better in conjunction with a hot-air tool made from a desoldering tool and a fish-tank air pump. As you pass the hot air over individual joints they reflow while the overall temperature can be kept down. But, once you have a whole-PCB-at-once method, you won't go back. I guess I need to try the skillet! This could also have the problem of overheating the PCB and reducing the bond strength, especially with the higher temperatures I'll need for lead-free solder. But, it does look as if the parts will be cooler than the heat-from-above of the toaster oven. I don't have a melting problem and one of my products is double-sided, so I'll put this experiment on the back burner (back burner ... get it?). Graham. _______________________________________________ AVR-chat mailing list [email protected] http://lists.nongnu.org/mailman/listinfo/avr-chat
