Dear all, I am sure the subject has been covered a number of times, however, I have been to the Machine Evaluation Workshop last week here in Liverpool and this company here http://www.iceotope.com/ done something which I found rather unusual. Rather then using pipes to cool the CPUs or dipping the whole node into silicon oil (messy) or water, they are using a hydrofluoro carbon compound to move the heat from the motherboard to a chilling plate. There are pros and cons of course. As the whole motherboard is sealed into the box you cannot change it yourself. It needs to be send back to them. On the flip side, it appears the the excess heat could be used a bit more efficiently. I was wondering whether somebody has some experiences with 'water' cooling in HPC and would like to share it with me? I am thinking of getting something like that or similar (no decision has been made right now) for the next server I am getting. However, as that is new technology to me (the 'water' cooling), before I venture into that I would like to hear some first hand experiences, not necessarily with the company/product mentioned above which is only an example here.
All the best from a wet London Jörg -- ************************************************************* Jörg Saßmannshausen University College London Department of Chemistry Gordon Street London WC1H 0AJ email: [email protected] web: http://sassy.formativ.net Please avoid sending me Word or PowerPoint attachments. See http://www.gnu.org/philosophy/no-word-attachments.html _______________________________________________ Beowulf mailing list, [email protected] sponsored by Penguin Computing To change your subscription (digest mode or unsubscribe) visit http://www.beowulf.org/mailman/listinfo/beowulf
