*Title : Windows Engg- Application Packaging lead* * Location : NYC, NY*
* Duration : 12+ Months* * Mode of Interview : Telephonic + Face2Face* *Experience – 5 – 8 years* *Technical skill sets – * • Good Client coordination • Knowledge of Windows 7 Desktop administration • Knowledge of Powershell or VB Scripting will be advantage • Knowledge of Application deployment • Knowledge of Application life cycle management will be advantage • Knowledge of Application Packaging with Admin Studio • Very strong Troubleshooting and Technical skills. • Must be able to help team Technically for the escalated issues. • Knowledge of various project software like Powerpoint/Project/Visio *Regards,* Amit Sharma Sr. Technical Recruiter IDC Technologies Inc. 1851 McCarthy Blvd Milpitas, CA 95035 *Call: *408-457-9381 *Ext.* 4011 | *IM:* amitsharma.rgtalent (Gtalk/YIM) *Email:** [email protected] <[email protected]> * *Website:* www.idctechnologies.com -- -- To unsubscribe from this group, send email to [email protected] For more options, visit this group at http://groups.google.com/group/CBE-Software-Engineer?hl=en --- You received this message because you are subscribed to the Google Groups "CBE Software Engineer" group. To unsubscribe from this group and stop receiving emails from it, send an email to [email protected]. For more options, visit https://groups.google.com/d/optout.
