For fully potted parts like the 48T59, I make four cuts along the sides of the encapsulation, on the short ends I cut until I hit metal (pins coming up from the IC to the crystal/battery). On the long ends I just cut deep enough to get through the pot shell and into the potting compound a little. Then I put a small chisel or large screwdriver in one of the cuts on the short ends, and strike it with a small ball peen hammer. This will usually split the encapsulation right off, but sometimes you have to flip it over and do the same on the other short end.
I probably need to do a writeup on fully potted parts, like the 48T59 and DS1287. Thanks, Jonathan On Tue, Nov 27, 2018 at 6:52 AM Al Kossow via cctalk <[email protected]> wrote: > > > On 11/26/18 2:42 PM, systems_glitch via cctalk wrote: > > I'm not sure, I don't personally see it as something worthwhile to > > investigate when you can just rebuild the old NVRAMs. > > What is the best way to decap 28 pin parts? 24-pin ones come apart pretty > easily but they don't leave a gap on the 28 pin ones. > > >
