yea, that was it http://www.computerhistory.org/collections/catalog/XD37.80
I didn't know we had this example in the collection, they were hybrids like IBM SLDs Do you know of any module part numbers that used them? On 12/21/18 2:40 PM, William Donzelli wrote: >> The original "Flip Chip" was a packaging failure. It was literally a die >> bonded to a PCB >> and never went into production. >> >> I think it is mentioned in "Computer Engineering" >> >> IBM perfected the techniques to do this later with the development of solder >> bumps and >> IR reflow. > > Are you talking about the little black rectangles, sort of SIP > packages, DEC tried in the late 1960s? They were a disaster with > reliability, but they did ship. > > -- > Will >