depotting news

[Jeffrey Meade]

I wonder if this would work with IC dissection?  Husky injection-molding machines make a tool to remove plastic from injection-molding machines, especially removing plastic from inside injection molds and from the nozzle where the plastic leaks.  The Power DFX uses low-flow technology to generate fine particles of dry ice that blast through small venturi nozzles in a stream of compressed air. When the particles hit the mold surface, they vaporize into CO2 gas, causing microscopic explosions that flush molding residues from the steel surface. “This offers a number of advantages over manual systems, which use hazardous solvents and disposable wipes, not to mention that the manual approach is far more time-consuming,” says Bruce Catoen, Husky’s Vice President, Systems. “The Power DFX is also much quieter, easier to use, and it gets into hard-to-reach areas better than traditional dry ice cleaning systems.”  http://www.husky.ca/news_release/2001-10-25-f.html   Another idea would be to co-opt the medical dissection auto tomb method of scraping and photographing frozen biological samples.  You could use an automatic grinder to remove one thousandth of an inch at a time from the entire surface of the IC.  Each pass would expose sections of parts.  Every small machine shop has at least one small diamond wheel grinder with a reciprocating table.  Manually measure what appears and make a three-dimensional map as the IC is slowly ground away.  You might have to dissect several IC chips from different angles to render the identification of every discrete component.  You should be able to salvage transistors and IC's intact because they have their own plastic case.    Jeffrey Meade 713 Seventh Street NE North Canton, Ohio 44720-2016 [EMAIL PROTECTED] 330.497.0736 evenings