Nick Voth <[email protected]> wrote: > Often we bond several of them > with IMA to get better capacity, but higher bandwidth links are unavailable.
Well, if these DS1/ATM connections can be bonded with IMA, that certainly indicates they are true ATM, not FUNI/DXI, so "encapsulation atm-dxi" won't help, sorry. I don't know of any single piece of hardware that can take a CT3, internally break it up into T1s and handle each T1 as an ATM (not HDLC) interface. But you should be able to use standard TDM gear to pull T1s out of the CT3, and then find some gear that will do DS1/ATM given a single physical T1 interface. But wait a minute... the quoted sentence is in present tense. Do you already have a working setup? Your original message seemed to indicate that this was something you are *planning* to implement, and you were wondering if your PA-MC-T3 can handle it, weren't you? A bit confused, MS _______________________________________________ cisco-nsp mailing list [email protected] https://puck.nether.net/mailman/listinfo/cisco-nsp archive at http://puck.nether.net/pipermail/cisco-nsp/
