Hello, Just to throw more info into the fire:
"NXP readies ultra small 802.11b/g package" http://www.eetimes.com/news/latest/showArticle.jhtml?articleID=198100726 "NXP Semiconductors is about to start sampling a single-package 81-pin TFBGA Wi-Fi chip that it says is the smallest device yet for 802.11 b/g connectivity as well as offering very low power drain. Dubbed the GBM220, the device is targeted at feature phones and smartphones, handheld game consoles and PDAs and is scheduled for volume production by the fourth quarter of 2007. The part, which builds on NXP's BGW211, integrates the RF and baseband/MAC functions in a 5mm x 5mm TFBGA package that supports the SDIO/SPI host interfaces. " ... If someone doens't beat me too it, I add this info to the wiki sometime latter today. Steve _______________________________________________ OpenMoko community mailing list community@lists.openmoko.org http://lists.openmoko.org/mailman/listinfo/community