Hi, solidrun sells SOMs with the i.MX6
https://www.solid-run.com/freescale-imx6-family/imx6-som/ Not sure if this works for a phone formfactor and if it helps to reduce risk and cost. I can confirm that the stock Debian kernel runs very robust on their Cubox-i and Hummingboard using these SOMs. Open source graphics relies on etnaviv, this I have not yet tested myself. Rainer On Wednesday 22 February 2017 21:26:09 H. Nikolaus Schaller wrote: > Hi Alexey, > > > Am 22.02.2017 um 20:05 schrieb Alexey Ignatov <[email protected]>: > > > > Hello. > > > > 2017-02-22 18:55 GMT+02:00 H. Nikolaus Schaller <[email protected]>: > >> Snapdragon: would be fine, but unobtainable in small quantities. > >> Mediatek: afaik the same > >> RockChip: I don't know if they have PoP mobile chips > >> Allwinner: AFAIK no PoP and not power optimized for mobile operation > >> Apple A10: unobtainable > >> Exynos: AFAIK not well supported > >> > >> So TI did alway have the best support for the open/free soft/hardware > >> community (except the IMG PVR SGX). Hence the DM3730 would still be a very > >> good choice. > > > > And what about Freescale/NXP i.MX6 SoC's? There are PoP variants exists, > > Oh, nice. I wasn't aware of this. Last time I checked (may be 3 or 4 years > ago), > I didn't notice. Maybe it is newer and we had no need to reconsider. > > But a quad core ARM Cortex A9 doesn't look bad at all: > > http://www.nxp.com/assets/documents/data/en/data-sheets/IMX6DQCPOPEC.pdf > > Probably the right choice would be MCIMX6Q7CZK08AD which is available > in prototyping quantities: https://octopart.com/search?q=MCIMX6Q7CZK08AD > > But it is approx. 50% more expensive than the DM3730. > > Very interesting is that although they have a similar to the OMAP BGA grid > on the bottom side of the chip it appears as if it has a hard case. This makes > soldering much less risky because warpage during soldering is avoided. The > drawback may be that the total package is thicker (1.25mm + PoP) compared > to 0.9mm +PoP for OMAP-CBB package. > > Really good seems to be that it is 12x12mm like OMAP3. So it fits into the > available space. But it uses a 0.4mm pitch and 216 balls PoP memory instead > of 0.5mm and 168 balls. This means that it can't use the same memory chips > and we have to research if an 1GB DDR + 512MB NAND exists in that package. > > On the SoC I/O capabilities it looks at a first glance as if the interfaces > are similar enough that it could technically be possible to build a GTA04X6 > around it without loosing any functions (except analog TV output but it would > have HDMI). > > > and > > also great documentation and open-source community support (one > > example: Novena). Mainline kernel support is also just fine. > > I've worked with different i.MX SoC's for some time, it's not perfect, > > but much, much more developer-friendly than > > Allwinner/Broadcom/Samsung. > > Indeed! > > What a pity that we neither have money left nor capacity, to do another > redesign (which would mean reworking the power supply and almost the full > PCB layouts). > > BR and thanks for this suggestion, > Nikolaus > > _______________________________________________ > Community mailing list > [email protected] > http://lists.goldelico.com/mailman/listinfo.cgi/community > http://www.tinkerphones.org -- Rainer Dorsch http://bokomoko.de/
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