A decade ago, Saraswat's research group was the first to begin developing a new kind of chip architecture: the 3-dimensional integrated circuit (3-D IC). Compared to the 2-D planar chips in computers today, 3-D chips can provide the same processing power with a reduced chip surface area. Also, instead of having long, twisting highways of wires, the stacked chips in 3-D ICs allow for short wires much like elevator shafts, as Professor Chidsey puts it-mitigating the problem of delay in the wires. Moreover, 3-D IC architecture allows the integration of all kinds of chips, since chips that require different technologies or materials can be stacked together.
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