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Courtesy of Steve Block Volume II, Issue 2 17 Sizing Up Nanotechnology Block, is that "if we are ever to build machines which are in any way based on biological structures, then we will have to learn about how real biological systems function." A decade ago, Saraswat's research group was the first to begin developing a new kind of chip architecture: the 3-dimensional integrated circuit (3-D IC). Compared to the 2-D planar chips in computers today, 3-D chips can provide the same processing power with a reduced chip surface area. Also, instead of having long, twisting highways of wires, the stacked chips in 3-D ICs allow for short wires much like elevator shafts, as Professor Chidsey puts it-mitigating the problem of delay in the wires. Moreover, 3-D IC architecture allows the integration of all kinds of chips, since chips that require different technologies or materials can be stacked together. Electronics: Building Chips in 3-D Dr. Krishna Saraswat, Electronic Engineering; Dr. Chris Chidsey, Chemistry -- To UNSUBSCRIBE, email to [EMAIL PROTECTED] with a subject of "unsubscribe". Trouble? Contact [EMAIL PROTECTED]
