https://bugs.dpdk.org/show_bug.cgi?id=1699
Bug ID: 1699
Summary: Bonding device documentation missing
Product: DPDK
Version: 25.03
Hardware: All
OS: All
Status: UNCONFIRMED
Severity: minor
Priority: Normal
Component: ethdev
Assignee: [email protected]
Reporter: [email protected]
Target Milestone: ---
There is no entry in the PMD feature matrix for bonding device.
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