We are currently engaged in changing the motherboards in over a hundred XO-1.5s. In many cases, the XOs are failing the heat spreader test afterwards.
However, we can get the test to pass if we press down on the lid, behind the screen. This suggests to me that the heat spreader is not in proper contact with the chips. Without the lid plastic affixed (heat spreader exposed), we can see that the spreader is not touching the chips properly. We have tried bending the metal slightly near the screw points, but the contact doesn't last. Is there any way that we can deal with this better? We are changing the motherboards in these XOs because they have succumbed to overheating. I want to avoid that from happening again. Thanks, Sridhar Sridhar Dhanapalan Engineering Manager One Laptop per Child Australia M: +61 425 239 701 E: [email protected] A: G.P.O. Box 731 Sydney, NSW 2001 W: www.laptop.org.au _______________________________________________ Devel mailing list [email protected] http://lists.laptop.org/listinfo/devel
