philippe_44 wrote: > Electronics manufacturers, we do burn-in (at elevated T° often) to cause > early failure for components that have a potential problem. Wafer > processes have variability and that creates transistors or metal layers > not in spec. It's reliability and sorting, not to adjust parametrics
Why you've made the very point for me! The point was not that burn in is done to "adjust parametrics".... but rather... During burn in... THINGS CHANGE!!!! > To cause early failure for components that have a potential problem It..(burn in) would not DO that..... if it didn't cause things to change!!!!!!!!!! ------------------------------------------------------------------------ gregm's Profile: http://forums.slimdevices.com/member.php?userid=66863 View this thread: http://forums.slimdevices.com/showthread.php?t=107360
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