Hello. On Wed, 2011-05-04 at 12:11, Werner Almesberger wrote: > > A two-phase approach would also be possible: bundle boards with > silicone or sugru and ship them soon, see how things go, and then > consider developing a proper case.
I would vote for this option. Delaying them for case design ould take some months and I think it would be good to get them out soon. :) regards Stefan Schmidt _______________________________________________ Qi Hardware Discussion List Mail to list (members only): [email protected] Subscribe or Unsubscribe: http://lists.en.qi-hardware.com/mailman/listinfo/discussion
