Hi, About these footprints made by Fped, can be used in KiCad. So we collected footprints under KiCad Libraries, still some few footprints from else projects have not been added. See INFO, http://projects.qi-hardware.com/index.php/p/kicad-libs/source/tree/master/modules/INFO
Most of them are for M1r4, few are for other projects. Before editing, normally reference to module's datasheet to find info of 'package drawing' and 'land pattern'. A good chip maker supposedly provides both of them. But practically it's not in usual. Another IPC standard 7351 is thorough document to know Generic Requirements for Surface Mount Design and Land Pattern Standard. It's a very good guideline and info to completely build generic package(i.e.: discrete components gullwing leaded components, two sides J-Leaded components, two sides gullwing leaded components, four sides J-Leaded components, four sides Post (DIP) leads, two sides Area Array components (BGA, FBGA, CGA) no lead components (QFN, SON, LCC)) so a research work indeed needed but take times. If you are lucky, maker did all details for you. While editing 'c-t-smd' packages for Chip SMD Tantalum Capacitors, KEMET lists directly dimensions for three levels of density, so I named variants with "TC-$Case-$EIA-$Density": Case is as capacitor type, EIA is its standard size, Density is for density level from IPC. Then a work in Fped GUI is easy. If not, editing package work is more likely a follow-up with datasheet. Even it's not enough to know if completely met with IPC. At least component maker will show up which standard they follows and usually set dimensions in as "Density Level B: Median (Nominal) Land Protrusion". Means that there's a lot of improvements could be studied in the future once you use for your need. Btw, it's a start. The lists of file name(*.fpd) below are shown: 8_10-card 8_10-socket-ra bga >> only for 484 pins c-smd >> Chip SMD Aluminum Electrolytic Capacitors c-t-smd >> Chip SMD Tantalum Capacitors dcjack din-5 do-214 dvi-recept-ra eus fiducial he-2row-dip header he-shrouded ir ledsmd mdip meander-2.4GHz mic-ra-dip mini_usb_b pads pads-array qfn qfp phonejack rca-3-ra rj45 soic sot sot23 stdpass mmst3904 spacer ssop tactile-sw-spst-ra-dip to tsop tssop5 usb-a-dual-recept-r usb_a_plug_smt usb-a-pcb xlr-socket xlr-plug xtal-2 xtal-4 Regards, -- Adam
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