Richard Ch?vez wrote: > The reason of this is that the solder paste would end up filling the holes > after reflow making it difficult to place the THT components
So it happens in real life. This would indeed be a killer. How about chemically unstable surface finishes, like OSP ? Is the degradation of the finish an issue in cases where you combine SMT with a later TH pass ? If yes, would you consider taking your chances with solder paste in this case ? Or is OSP simply incompatible with a mixed SMT+TH process and nobody in their right mind would try such a combination ? Thanks, - Werner _______________________________________________ Qi Hardware Discussion List Mail to list (members only): [email protected] Subscribe or Unsubscribe: http://lists.en.qi-hardware.com/mailman/listinfo/discussion
