I thought we were talking about putting parts INTO the tin. If you gradually equalize the potential of the parts with respect to the muffin tin before putting them into it, yeah ... that will work OK. But then the resistor to ground from the tin is a don't care .. it doesn't accomplish anything as far as ESD goes.
Using the same protocol as stuffing a PC board is good advice, but the only thing a resistor to ground accomplishes is to provide a reasonably common reference point if you're moving stuff (components, tools, yourself) around from place to place. Once everything is in the same spot it doesn't have much meaning. Dave AB7E On 12/18/2010 5:43 PM, Ron D'Eau Claire wrote: > Not if the tin is grounded. > > If not grounded, the capacity charge is taken care of by touching the tin > before touching it with the part, just like when installing a part in a pc > board. > > As I said, use the same protocol as if installing a part in a pc board. > > Ron AC7AC > > -----Original Message----- > That's no guarantee of anything. It doesn't address the issue of > instantaneous static dissipation from the component to the muffin tin > itself (which has capacity to its surroundings and acts as it's own > charge sink). Reread Gary's comment about surface conductivity. > > Dave AB7E > > ______________________________________________________________ > Elecraft mailing list > Home: http://mailman.qth.net/mailman/listinfo/elecraft > Help: http://mailman.qth.net/mmfaq.htm > Post: mailto:[email protected] > > This list hosted by: http://www.qsl.net > Please help support this email list: http://www.qsl.net/donate.html > ______________________________________________________________ Elecraft mailing list Home: http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/mmfaq.htm Post: mailto:[email protected] This list hosted by: http://www.qsl.net Please help support this email list: http://www.qsl.net/donate.html
