Jack Smith wrote:
>BPS makes a small grid prototype board that will mount a variety of SMT 
>parts - one board accommodates different size parts.
>
>http://www.busboard.us/pdfs/BPS-MAR-SP3UT-001.pdf
>

A small British company is now making RF prototyping boards that have 
square pads on a 0.1in grid, with a continuous copper groundplane on the 
reverse. Every pad has an unplated hole drilled through to the 
groundplane, which allows good RF grounding.

The board is very versatile because you can mix and match various styles 
of construction on the two different sides.

The groundplane side can be treated as continuous copper for dead-bug 
and 'ugly' styles of construction, but the pre-drilled holes make it 
very easy to connect through to the pad-style wiring on the other side. 
To make insulated lead-throughs, simply remove the copper around the 
selected holes.

On the pad side, the 0.1in grid is suitable for conventional wire-leaded 
devices and DIL ICs, along with many of the larger SMD packages. 
Smaller-pitch devices can be soldered dead-bug style on either side of 
the board - whichever way works better for that particular part of the 
circuit.

<http://cgi.ebay.co.uk/RF-Matrix-PadBoard-149x114x1-6-Prototype-Circuit-B
oard-/170586485860>


-- 

73 from Ian GM3SEK
http://www.ifwtech.co.uk/g3sek
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