I find the "clicks" my KPA500 makes as its temperature changes to be quite distracting. Part of the problem is that I'm chasing a problem where the KPA500 changes band spuriously and the thermal clicks sound too much like the relays re-configuring the LPF.
To what extend does the thermal design require conduction between the PA heat sink and the case metalwork? Would the thermal management be compromised if very thin mylar strips were placed between the heat sink and the case side panel , case rear panel, or Z bracket? Any other proven techniques for eliminating the thermal expansion/contraction clicks? (I know the manual says this is normal so no need to tell me that). 73, Andy k3wyc ______________________________________________________________ Elecraft mailing list Home: http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/mmfaq.htm Post: mailto:[email protected] This list hosted by: http://www.qsl.net Please help support this email list: http://www.qsl.net/donate.html Message delivered to [email protected]
