When I removed the KPA100 PC board to do the KPA100 Upgrade the thermal pads of 
Q1 and Q2 stuck to the transistors.  I noticed that the bottom of these pads 
were silvery where they joined the heat sink.  Some of the black part of the 
pads remained with the heat sink.  I will replace these thermal pads.  Should I 
attempt to clean off the heat sink surface where these pads left their residue? 
 And yes, I will be very attentive in tightening these screws after a small 
amount of use in the future.  These pads I am removing are not the original 
pads, so I don't think I have overly abused the finals.   Thanks for any 
comments.
Roy Morris  W4WFB
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