Wiping the tip (clean iron tip, well tinned) before each joint is made when doing pads and wetting the tip with the tip of the wire solder are key steps. Touch the tip with fresh solder just before starting to solder the joint. Apply the solder wire to the junction of the lead, pad, and iron tip. Hold steady until you see full wetting action, then get the heated tip off the joint in a smooth motion.
Also, use smaller diameter solder when you are doing just a pin of a active IC/ transistor, larger solder when doing shield can soldering, etc. Make the solder fit the work. Proper heat and tip size has been mentioned. A high intensity light for older eyes and a lighted magnifier make inspection of each joint a faster process. The light helps insure you got solder all around a pad, wire lead, device lead, etc. Practice with a heat controlled iron, or a smaller constant wattage iron, makes perfect solder joints. Inspection though, is still needed just in case you get in a hurry. Check the tightness of your element and tip before you fire up the iron. Stop working when you are tired, or eyesight gets fuzzy. Don't rush an assembly job. Check off each step, read it first, understand before you do anything. Double check that you have the right value part, check off each step after inspecting the joints and the parts used in that step. Read the manuals through before starting a kit. Clarify any unclear points. This forum is very helpful as there are a lot of experienced builders of the same units here as the one you may be assembling. GL and 73, Stuart K5KVH _______________________________________________ Elecraft mailing list Post to: [email protected] You must be a subscriber to post to the list. Subscriber Info (Addr. Change, sub, unsub etc.): http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/subscribers.htm Elecraft web page: http://www.elecraft.com
