Tom, In a word - NOT RECOMMENDED.
Sockets do not provide connections as good as soldering in place, the sockets make the RF paths longer which may cause problems, and are another source for failure. The RF Path lengths would be especially sensitive in the bandpass filter area of the K2, the relays should be soldered in place. Components do not fail often, so replacement of components is not a valid concern in hardware that uses a conservative design (like the K2) which does not stress the components beyond their ratings. As for tie-in of external circuits, that can be done by soldering to IC pins or by placing components on the bottom of the board. Upgrades usually do not involve changing a relay or an IC - most upgrades involve only changes to resistors, capacitors, diodes and other similar components, and a socketed arrangement will likely not help for any of the upgrades that may come along. 73, Don W3FPR > -----Original Message----- > > I am thinking about inserting sockets under a couple of the > relays on the RF > board, to make it easy to connect some probes or tie in external > circuitry > later. Of course this would also make it easier to upgrade or > replace them too. > > I would think using low profile sockets would not imact the > physical/electrical integrity of the board. Wonder if anybody > else has done > this, or if there are any concerns about doing so. > > 73, > > Tom KG3V > -- No virus found in this outgoing message. Checked by AVG Free Edition. Version: 7.5.432 / Virus Database: 268.15.15/581 - Release Date: 12/9/2006 3:41 PM _______________________________________________ Elecraft mailing list Post to: Elecraft@mailman.qth.net You must be a subscriber to post to the list. Subscriber Info (Addr. Change, sub, unsub etc.): http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/subscribers.htm Elecraft web page: http://www.elecraft.com
