Angie,
You are quite correct - can we blame it on a 'senior moment'?
I do trust the point was made, and I will not publish a correction other
than this post.
Just as verification of my points - I just finished a KX1 repair and
except for one misplaced component, the problems were all due to excess
solder and inadequately heated solder pads. At least 5 problems were
identified, but then I removed the excess solder and re-soldered
components in a large area each time, so who knows how many more were
actually present. This *is the* most common cause of kit building failure.
73,
Don W3FPR
Augie Hansen wrote:
Hi Don,
Given the way you phrased the questions, I believe that a "no" answer
to one or more would indicate a soldering problem. Wouldn't "yes" to
all indicate successful soldering?
...
The very most likely problem is that you have a soldering joint failure.
Look very critically at your solder connections. Is there just a
slight bit more solder applied than that required to fill the
thru-plated hole? Do all the solder joints have a smooth concave
slope on the sides? Do the edges of the solder joint taper out to an
almost invisible edge on both the solder pad and the component lead?
If the answer to any of the above questions is yes, then your
soldering is certainly suspect. You must apply enough heat to cause
the solder to flow out onto the solder pad and down into the
thru-plated hole. Any solder connections that have a blob of solder
on them are not well soldered connections. An excess of solder can
hide a poorly soldered joint, and in fact is the usual appearance of
a bad solder joint.
Gus Hansen
KB0YH
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