Passing on another non-member post......

Jim

>>> "Hight, Kevin" <[email protected]> 10/14 7:16 PM >>>

> IEEE EMC SOCIETY
> 
> ROCKY MOUNTAIN CHAPTER
> 
> OCTOBER MEETING
> 
> TUESDAY OCTOBER 20, 1998
> 
> Mr. Robert W. Dockey
> Hewlett-Packard Company
> 
> "New Techniques for Reducing Printed Circuit Board
>  Common-Mode Radiation"
> 
> WHERE:        NIST - Boulder
>       325 Broadway
>       Boulder, Colorado  80303
> 
> TIME: 7:00 p.m.
> 
> DIRECTIONS:   From Denver take I-25 to Highway 36.  Go NW on Highway 36 to
> Boulder.  Continue on Highway 36 to Baseline Road.  Take Baseline Road
> West one block to 27th Way.  Turn South (left) on 27th Way and continue
> past Broadway into the NIST parking lot.  Enter through the Main doors
> (facing Broadway) and check in with the guard at the front desk, the guard
> will direct you to our meeting room.
> 
> DINNER:       5:30 p.m. - 6:45 p.m.   Rafferty's Restaurant
>       2805 Pearl, Boulder, Colorado 80301, Phone; (303) 447-2665
>       Rafferty's is on the corner of 28th (Highway 36) and Pearl.  From
> Baseline road, continue North on Highway 36 (28th Street) 5 stop lights.
> Take next Right into the parking lot of Rafferty's.  See you there!
>       RSVP to Kevin Hight at 303-417-5534 by noon on the 19th.
> 
> For more information please contact one of the IEEE Rocky Mountain Chapter
> EMC Society Officers listed below.
> Chairman:             Jeff Doolittle  303-449-4165
> Vice Chairman:                Joe Kramer      303-449-4165
> Secretary:            Kevin Hight     303-417-5534
> Treasurer:            Wes Smith       970-962-7472
> 
> EVERYONE IS WELCOME !
> 
> 
> AUTHOR BIOGRAPHY
> Robert Dockey
> Bob is the EMC Engineering Group manager at the Hewlett Packard division
> in Vancouver Washington. He has a BSEE from the University of Missouri at
> Rolla and is certified as an EMC engineer by the National Association of
> Radio and Television Engineers. He is the author of three technical papers
> on various EMC subjects and is a member and Distinguished Lecturer of the
> IEEE EMC Society.
> 
> Bob has been with Hewlett Packard for 13 years as both an EMC engineer and
> engineering manager. Previously, he spent 13 years as a TEMPEST
> engineering manager for TRW in Colorado Springs, Colo.
> 
> 
> 
> INTRODUCTION
> Have you ever had the experience of believing that you had done everything
> humanly possible to reduce the radiated emissions from an unshielded
> printed circuit assembly and yet still measure unacceptable margins? If
> so, this presentation could help explain the reasons why. Even when all of
> the common emission suppression measures like power supply decoupling,
> cable filtering, loop area control and full ground planes have been
> utilized, there is still one dominant coupling mechanism remaining which
> can be manipulated to improve the margin.  Unfortunately it may also set a
> lower limit on the possible emission level which can be obtained from a
> specific design. This mechanism is referred to as "Ground Plane Voltage
> Gradient" contamination. This presentation will attempt to describe and
> analyze this radiated emission mechanism and present several design
> techniques which can be used to deal with it successfully.
> 
>  "New Techniques for Reducing Printed Circuit Board Common-Mode Radiation"
> ABSTRACT
> A multi-layer printed circuit board with a "good ground plane" can produce
> common-mode radiation similar to a dipole antenna. This ground plane is
> commonly thought of as a low impedance path for returning currents and one
> which is of constant potential across its area. In fact, these currents
> give rise to voltage gradients in the plane which act as sources of
> common-mode current. The majority of the RF current flowing along a signal
> trace on a multi-layer printed circuit board (PCB) returns on the ground
> plane directly beneath the signal trace. However, a small portion of the
> ground-plane current also can return via indirect paths causing the PCB
> and attached cables (if present) to produce common-mode radiation similar
> to a dipole antenna. Several new techniques to reduce these emissions by
> lowering the inductance of the ground return or by bypassing the
> common-mode current on the cables are presented. These cost-effective
> techniques can be employed on two-sided or multi-layer PCBs.
> Previous independent work by German, Ott and Paul experimentally
> investigated the radiated emissions from a printed circuit board (PCB)
> with a digital circuit that produced current on a signal trace that
> returned via an adjacent ground-return trace. They demonstrated that if
> this two-wire transmission-line is slightly unbalanced, it will radiate as
> an asymmetric dipole antenna producing common-mode radiation at much
> greater levels than the differential-mode radiation from the current loop.
> A direct prediction of this radiation was later performed by Hardin, Paul
> and Naishadham.
> 
> In 1993, Dockey discovered that a relatively small PCB with a solid
> ground-plane could also produce common-mode radiation. On this truncated
> Microstrip transmission-line, the majority of the signal-trace current
> returns on the ground plane beneath the signal trace. However, this
> current encounters the finite inductance of the ground plane and produces
> a voltage gradient. The voltage gradient, commonly called the ground-noise
> voltage, then causes a small portion of the signal-trace current to flow
> through the distributed stray capacitance of the ground plane.
> 
> This presentation will elaborate on these findings and propose several
> methods which can be used to effectively mitigate the radiation
> mechanisms.
> 
> 
> 


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