Thought this might be of interest to a few of my friends in the EMC-PSTC group. [actually, given the location, I think it would be of interest to everyone. Its just that only a few of you may be component packaging experts.] I have no formal association with this group other than being on their mailing list, so direct any questions to the people listed at the end.
Regards, Richard Cass ______________________________ Forward Header __________________________________ Subject: InterPack '99 - CALL FOR PAPERS Author: "J. Lee" <[email protected]> at internet List-Post: [email protected] Date: 11/24/98 2:38 PM CALL FOR PAPERS FOR A SESSION ON ACCELERATED PRODUCT QUALIFICATION InterPack '99 The Pacific Rim/ASME International, Intersociety Electronic Packaging Conference Westin Maui Kaanapali Beach Hotel Lahaina, Hawaii, USA June 13-19, 1999 You are invited to submit a paper for presentation at InterPack'99, to be held in Hawaii, June 13-19, 1999. InterPack is sponsored by ASME International and is intended as a forum for dissemination of information related to the field of Electronic and Photonic Packaging. The objectives of the conference are to foster international cooperation, understanding and promotion of efforts in Microelectronics, Optoelectronics, and Photonics Packaging Engineering in an East/West business setting. The Accelerated Product Qualification track invites papers that report on aspects of accelerated testing that include and not limited to: state-of-the-art in accelerated testing, complex stress environments, stress interaction in combined stress testing, state-of-the-art test hardware and software, predictive failure models and mechanisms, computer modeling and simulation, field to test correlation, role of material characterization, role of failure analysis, statistical issues in determining sample sizes, and quantitative estimate of field reliability from testing. Overall, the session is intended to provide a broad coverage of the state-of-the-art in accelerated testing, physics, and modeling techniques. Prospective authors should submit an abstract of approximately 200 words in length with name, title, company, address, phone, fax and email to one of the following: Rakesh Agarwal email: [email protected] Ph. : 765-451-7361 Fax: 765-451-9874 Delphi Automotive Systems, One Corporate Center, MS R103, Kokomo, IN 46904-9005. Abhijit Dasgupta email: [email protected] Ph.: 301-405-5251, Fax: 301-314-9477/9269 CALCE EPRC, Mechanical Engineering, University of Maryland, College Park, MD 20742 Mark Gibbel email: [email protected] Ph.: 818-542-6985/6979 Fax: 818 249-5714 All papers will be reviewed in accordance with standard ASME procedures. Please note the following deadlines: November 27, 1998 Three copies of a 200 to 300 word abstract. We appreciate communication of the intent to submit an abstract with the paper title, if the abstract is not available at the current time. December 15, 1998 Author notification of abstract acceptance December 31, 1998 Five copies of full paper or extended abstracts to one of the session organizers for peer review February 1, 1999 Author notification of paper acceptance March 8, 1999 Final manuscripts due to ASME For additional information about the Accelerated Product Qualification track sessions contact us or look up the following web sites: http://members.aol.com/intpak99/intpak99.htm or http://www.asme.org. Rakesh Agarwal Abihijit Dasgupta Mark Gibbel --------- This message is coming from the emc-pstc discussion list. To cancel your subscription, send mail to [email protected] with the single line: "unsubscribe emc-pstc" (without the quotes). For help, send mail to [email protected], [email protected], [email protected], or [email protected] (the list administrators).
