> -----Original Message----- > From: Grasso, Charles (Chaz) > Sent: Thursday, December 16, 1999 10:58 AM > To: 'Signal Integrity' > Cc: Charbonneau, Richard A > Subject: Embedded Capacitance Project > > Hello, > > Please find attached information regarding the NCMS Workshop > on Embedded Capacitance. > > ----------------------------------------------- > > <<EDC-FlierFeb2000.pdf>> > I have included the text below: > CONFERENCE DESCRIPTION: The development and use of Embedded Capacitance > Date: Feb 28-29th > Location: Tempe Arizona > > > Shelly, In case your Adobe still dies on you , I have added the > texr description below: > > Text Description: > The Need: > The need for power-ground decoupling capacitance is nearly > universal in electronic circuits. Today, the solution to that > need is found in discrete chip capacitors. These devices > provide a wide range of capacitance values and many > excellent properties, such as stability over temperature and > frequency and reliability. However, use of discrete chip > capacitors also poses some fundamental problems - prob-lems > such as the significant cost of producing them in large > numbers and the amount of surface area they consume on > the circuit board. In addition, few designers or maintenance > engineers understand, with any rigor, how many decoupling > capacitors are truly required, how much capacitance they > should have, and where to locate them on the circuit. > In response to these inherent problems, and supported by > the findings of recent industry roadmaps, OEMs are now > viewing embedded passives technology as a promising > alternative to discrete passives in electronics manufacturing. > Embedding the capacitance in the circuit board frees up > space that can be used for other functions. The technology > may also improve performance and reliability by reducing > the number of solder joints and discrete capacitors, and > the associated failure modes. In addition, totalsystem cost > may also be lowered as a result of parts reduction and circuit > integration. However,efforts by one company - or even a small group of > companies - do not have high probability of success. > The case for a group effort was justified: the investigation > of multiple materials, with multiple fabricators,produces multiple chances > for success, with the efforts of each participant being highly leveraged. > The Project: > Recognizing the value of a collective solution, NCMS, together with more > than a > dozen partners, organized a collaborative effort aimed at advancing the > use of embedded capacitance technology for power supply decoupling. > The goal of the project was to encourage the development > and use of embedded capacitive materials in printed circuit boards. The > project team focused on the embedding of a single large (distributed) > capacitance within the circuit board. The team anticipates > that this capacitance will be utilized for power > supply decoupling. > Commercially available materials and developmental materials were > evaluated for > compatibility with the circuit board manufacturing > process, for materials properties, for reliability, and for > their ability to perform the decoupling function. The > project has thus taken some of the first steps towards the > realization of embedded passives in organic substrates. > Workshop Goal: > This workshop will provide a forum in which program > results can be disseminated to a targeted group of industry > representatives. Specifically, members of the project team > and NCMS's program manager will offer workshop > participants information and facilitated discussions on the > following: goals and objectives, test vehicle design, mate-rial > test results, reliability test results, electrical test results > (decoupling and EMI), and modeling of the electrical > performance of embedded distributed capacitance (EDC). > Why attend: > * Learn when, where, how to use these new EDC materials > * Learn from PWB fabricators technical know-how and > lessons learned > * Learn recommended design guidelines > * Receive workshop proceedings > * Receive project final report at 60% savings > Who should attend: > Individuals responsible for: > * PWB Fabrication > * PWB Design > * Electronic Products Designs > High-Speed Digital Designers > should NOT miss this workshop. > Development and Use of > Embedded Capacitance > Materials in Printed Circuit Boards > The Embedded Decoupling > Capacitance Consortium > Members > StorageTek > Delphi Delco > Electronics Systems > Raytheon Systems > 3M Corporation > E.I. DuPont de > Nemours Co., Inc. > Litton Advanced > Circuitry > HADCO > Merix > National Institute of Stan-dards > and Technology > Penn State University > University of > Missouri - Rolla > National Center for > Manufacturing Sciences > Tobyhanna Army Depot > A Workshop > Conducted by: > The National Center for > Manufacturing Sciences > Embedded Decoupling > Capacitance Consortium > February > 28-29, 2000 > Fiesta Inn > Tempe, Arizona >
EDC-FlierFeb2000.pdf
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