I recall many messages regarding trace separation, etc. to meet certain voltage isolation requirements; however, none of those specs are applicable to my products. Is there a general guideline for separating traces to meet isolation requirements and survive a 2000 VDC (input to chassis) hi-pot requirement?
I have heard that using 25 mil separation is a rule of thumb ... accurate? Susan H. Beard 321-435-7762 Fax 321-435-7957 [email protected] ------------------------------------------- This message is from the IEEE EMC Society Product Safety Technical Committee emc-pstc discussion list. To cancel your subscription, send mail to: [email protected] with the single line: unsubscribe emc-pstc For help, send mail to the list administrators: Jim Bacher: [email protected] Michael Garretson: [email protected] For policy questions, send mail to: Richard Nute: [email protected]
