Daniel,

This is a Facilities standard orginiated by the SEMI organization and deals
with Voltage Sag Ride-through capabilty.  You can buy this and other
standards paper or PDF for $50.00 each at
http://www.semi.org/web/wstandards.nsf/

Here is the abstract:

SEMI F47-0200 Specification for Semiconductor Processing Equipment Voltage
Sag Immunity

Semiconductor factories require high levels of power quality due to the
sensitivity of equipment and process controls. Semiconductor processing
equipment is especially vulnerable to voltage sags. This document defines
the voltage sag ride-through capability required for semiconductor
processing, metrology, and automated test equipment. The requirements in
this international standard were developed to satisfy semiconductor industry
needs. While more stringent than existing generic standards, this
industry-specific specification is not in conflict with known generic
equipment regulations from other regions or generic equipment standards from
other organizations. It is the intent of this standard to provide
specifications for semiconductor processing equipment that will lead to
improved selection criteria for sub-components and improvements in equipment
systems design. While it is recognized that in certain extreme cases or for
specific functions battery storage devices may be appropriate, it is not the
intent of this standard to increase the size or use of battery storage
devices provided with equipment. Focus on improvements in equipment
component and system design should lead to a reduction or elimination in the
use of battery storage devices to achieve equipment reliability during
voltage sag events. This document specifies the minimum voltage sag
ride-through capability design requirements for equipment used in the
semiconductor industry. The expected equipment performance capability is
shown graphically on a chart representing voltage sag duration and percent
deviation of equipment nominal voltage. Standard evaluation test method
references are also included. The primary focus for this specification is
semiconductor processing equipment including but not limited to the
following tool types: etch equipment (Dry & Wet), film deposition equipment
(CVD & PVD), thermal equipment, surface prep and clean, photolithography
equipment (Stepper & Tracks), Chemical Mechanical Polishing equipment, Ion
Implant equipment, Metrology equipment, and automated test equipment. This
specification applies to semiconductor processing equipment to include the
equipment mainframe and all subsystems whose electrical power is directly
affected by the operation of the equipment's EMO system. 

Referenced SEMI Standards: SEMI E10 -- Standard for Definition and
Measurement of Equipment Reliability, Availability, and Maintainability
(RAM), SEMI E51 -- Guide for Typical Facilities Services and Termination
Matrix, SEMI F42 -- Test Method for Semiconductor Processing Equipment
Voltage Sag Immunity, and SEMI S2 -- Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment 


-doug

=================================
Douglas E. Powell
Regulatory Compliance Engineer
Advanced Energy Industries, Inc. 
1625 Sharp Point Dr.
Ft. Collins, Co 80525

mailto:[email protected]
http:\\www.advanced-energy.com\
=================================


-----Original Message-----
From: Biggs, Daniel (IndSys, GEFanuc, NA)
[mailto:[email protected]]
Sent: Thursday, July 27, 2000 10:55 AM
To: 'Emc-Pstc (E-mail)'
Subject: SEMI F47



Has anyone on this list heard of standard SEMI F47?  Is there a similar
european standard to this?  What exactly does the standard deal with?

DB


> g         GE Industrial Systems
> _______________________________________________________
> 
> Daniel Biggs                    
> Test Engineer
> Hardware Design Services
> 
> GE Fanuc Automation
> PO Box 8106
> Charlottesville, VA  22906
> PH:  (804) 978-6946  
> Fax:  (804) 978-5588
> 
> 

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