Dan,
  Read on below R9-20 and the requirement is clarified significantly.  The
requirements are DEFINITELY applicable to the outputs of your DC/DC
converters (a.k.a. "embedded DC power supplies"):

If your 48V feeds into a power supply circuit pack/module which then
supplies the 3.3, 5, 12, etc... V to the other circuit packs, you must first
short the outputs of each individual DC/DC converter (within the common
power circuit pack/module) and then (provided you have a passing result from
the first test) place shorts on each type of circuit pack that is powered
from the common power supply circuit pack/module.  (Think of a Compact PCI
chassis for an example of this scenario).  You must perform the test on each
output.  

If you have your DC/DC converters on each individual circuit pack (most
complex telecom type boxes), You must first directly short the outputs of
each DC/DC Converter and then move the shorts out to a remote location on
the board (Replace a power cap with a short in somewhere on the far corner
of the board).  This must be done for every type of and each output on the
DC/DC modules.

Also, if you have DC/DC's of greater than 150W, the outputs are required to
be referenced to chassis (R9-9), so you will also need to short the
non-referenced side of the outputs to chassis.  This test checks the bonding
path to ensure that it is sufficient to carry any resulting fault current.
The reference path must not be damaged.

It should be noted that (contrary to R9-20) many RBOCs do allow damage
(damage free is effectively an 'Objective').  They have applied the "fire,
fragmentation, or electrical safety hazard" performance criteria to the
short circuit test.  The product does not necessarily have to function after
the test, it just can't catch the cheesecloth on fire or smoke too much
(although I've never actually seen a product catch fire, so I haven't looked
into this last cheesecloth/smoke bit too much).

I hope this helps,
Dave Heald


-----Original Message-----
From: Roman, Dan [mailto:[email protected]]
Sent: Thursday, September 12, 2002 8:24 AM
To: EMC-pstc List
Subject: NEBS - Bonding and Grounding



NEBS Gurus,

Do the 1089 bonding and grounding DC short circuit tests apply down to the
component level in a system or are they limited to the power supply or some
other demarcation point?  If it applies anywhere in the system it seems to
me that you'd never finish testing.  You'd have to test the power supply,
backplane, mother board, daughter cards, IC dies...sort of like doing the UL
15W test for home entertainment equipment.

Reading through section 9 and specifically 9.8 it seems they are keying on
the power supplied directly from the CBN and not that power indirectly
derived from the CBN after DC to DC converters.  Where is the demarcation
point if there is one?  Do labs that test to NEBS handle this consistently?

Thanks in advance.

Dan Roman
Compliance Engineer
Intel

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