Chris, I had a thought, reading your message, that even a plain metal sheet, if it is close to a half wavelength across, has an RF hot spot in the middle. In that case, you must keep one side of the sheet (plane) cold, while the other is not. This means good grounds (UHF RF returns) at the edges. Are corners alone, enough?
Following this reasoning, it seems to me your best chance of success, if you pursue the shielding route, is to put the (shield) plane on the solder side, facing the source, and route no traces (pickup loops!) on it. Put your plane between the source and the victim. However, I'd be inclined to beef up the victim's response, rather than shoehorn in a shield. For one thing, it is a pain in the neck for the board shop when you unbalance the stackup that way. May lower yield, depending on the board, unacceptably. For another, identifying and hardening a few strategic nets on the victim could be much cheaper to do. Maybe even faster; tooling not only costs, it takes time to add. Cortland PS: I haven't seen your board, of course, and it's difficult to do this work by telepathy (grin). Cortland ------------------------------------------- This message is from the IEEE EMC Society Product Safety Technical Committee emc-pstc discussion list. Visit our web site at: http://www.ewh.ieee.org/soc/emcs/pstc/ To cancel your subscription, send mail to: [email protected] with the single line: unsubscribe emc-pstc For help, send mail to the list administrators: Ron Pickard: [email protected] Dave Heald: [email protected] For policy questions, send mail to: Richard Nute: [email protected] Jim Bacher: [email protected] All emc-pstc postings are archived and searchable on the web at: http://ieeepstc.mindcruiser.com/ Click on "browse" and then "emc-pstc mailing list"
