Hi All, I just finished this month's Technical Tidbit article over the weekend. It deals with characterizing noise in chip packages and includes new information and data since my IEEE paper on the subject was written.
Abstract: Voltage drops in chip packages can cause significant signal integrity and EMC problems. The good news is that in many cases these voltages can be measured through mutual inductance. Measured results and their interpretation are discussed. The key here is interpretation of the scope waveforms. Two specific cases are studied in the article. The URL of the site is: http://emcesd.com Page down to the article link (picture of a probe on a chip package at the bottom of the page). Doug -- ___ _ Doug Smith \ / ) P.O. Box 1457 ========= Los Gatos, CA 95031-1457 _ / \ / \ _ TEL/FAX: 408-356-4186/358-3799 / /\ \ ] / /\ \ Mobile: 408-858-4528 | q-----( ) | o | Email: [email protected] \ _ / ] \ _ / Website: http://www.dsmith.org This message is from the IEEE EMC Society Product Safety Technical Committee emc-pstc discussion list. Visit our web site at: http://www.ewh.ieee.org/soc/emcs/pstc/ To cancel your subscription, send mail to: [email protected] with the single line: unsubscribe emc-pstc For help, send mail to the list administrators: Ron Pickard: [email protected] Dave Heald: [email protected] For policy questions, send mail to: Richard Nute: [email protected] Jim Bacher: [email protected] Archive is being moved, we will announce when it is back on-line. All emc-pstc postings are archived and searchable on the web at: http://www.ieeecommunities.org/emc-pstc
