Dear Colleagues: In order to avoid conflicts with the Thanksgiving weekend, this month's IEEE EMC Oregon & SW Washington Chapter meeting will be held on Wednesday, November 19th. It will be at the same location, Franz Hall 223 at the University of Portland. If you are planning to attend, please RSVP to this e-mail or register on the Section website (www.ieee-or.org).
This month's presentation will be on high speed PCB and backplane interconnects; the speaker will be Franz Gisin of Sanmina-SCI. More information can be found below. Hope to see you all there! Sincerely, Camille Good Communications Director, IEEE Oregon & SW Washington EMC Chapter ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Details for this mont's meeting: Topic: Thinking Outside of the Trace - The Physics of Hi! gh Speed PCB and Backplance Interconnects Speaker: Franz Gisin - Director, Backplane Design Technology & Signal Intergrity Design, Sanmina-SCI List-Post: [email protected] List-Post: [email protected] List-Post: [email protected] List-Post: [email protected] Date: Wednesday, November 19, 2003 Time: 6:30 pm for dinner, 7:00 pm for presentation (dinner will be pizza from Pizza Caboose) Where: University of Portland, Franz Hall 223 Map to University of Portland: http://www.worldaccessnet.com/%7Eemc/UP%20Map.htm Campus Map of University of Portland: http://www.worldaccessnet.com/%7Eemc/UP%20map1.htm To reserve your place and help us with planning, please RSVP to sender or register on the IEEE Section web site at http://www.ieee-or.org. About the presentation: Anyone who has spent any length of time wandering around within the Signal Integrity discipline, will, on occasion, take time out to reflect (and sometimes even wonder) on exactly what is it about pushing electrons around on conducting materials that causes them to misbeha! ve and distort signals as they are routed through high speed printed circuit boards and backplanes. We all know sharp trace bends and vias cause problems at high speeds, even though we may be a bit fuzzy about what specific characteristics of these structures cause electrons to not like them. Electrons flowing through traces generally don't wander into the dielectric, and so the role dielectric materials play in distorting a signal is not always intuitively obvious. Most high speed interconnects have memory, that is to say, they hold back a portion of the energy contained in the signals passing though them, and then release it back into the interconnect at a later time, creating inter-symbol interference (ISI) and other forms of mischief. If we are to minimize these effects, we must have a clear understanding where and how the energy is siphoned off, and what cost-effective options we have to minimize this undesirable phenomena. Mos! t of us are familiar with the circuit equivalents of high speed interconnects such as the RLGC transmission line model. But the values of the individual R, L, G, and C terms are all "derived parameters" that often involve ratios of vector integrals of the more fundamental electric and magnetic fields over open and closed surfaces and volumes. The simple act of using these circuit equivalents can impede our intuitive understanding of what role electrons and their associated electromagnetic fields have in distorting signals that pass through high speed interconnects. An alternate approach to analyzing high speed PCB and backplane interconnects is to completely bypass RLGC equivalent circuits and treat high speed interconnects as "guided wave" structures. One can then apply sophisticated 3D computer modeling codes - such as the Finite Difference Time Domain (FDTD) - to directly solve for the electric and magnetic fields in the regions surr! ounding the conductive "guiding" traces and associated ground return planes. Using this approach, all regions of a guided wave interconnect can be studied in detail without having to resort to the more complex (and less intuitive) R, L, G, and C "equivalent" circuit models. By animating simple metrics, for example the magnitude of the Poynting vector, |ExH|, one can quickly assess the impact high speed interconnect geometries and structures have on signals passing through them. About the speaker: Franz Gisin, is Director of Backplane Design Technology and Signal Integrity Design, with Sanmina-SCI, the world's largest EMS manufacturer of high performance printed circuit boards and backplanes. He has almost 30 years of experience in the fields of signal integrity (SI), Electromagnetic Compatibility (EMC), and related fields. He is a past IEEE distinguished lecturer, has taught signal integrity, EMC, and electromagnetics courses at San Fra! ncisco State University, and has published numerous papers and articles on modeling complex interconnect structures. He received his BS(EE) >from the University of Idaho in 1972, and his MS(Applied Math) >from Santa Clara University in 1986. Franz Gisin can be reached at (408) 904, 2105, [email protected]. _____ Do you Yahoo!? Protect your identity with Yahoo! Mail AddressGuard <http://antispam.yahoo.com/whatsnewfree>
