Gary,
Chapter 33 of my book Robust Electronic Design Reference Book, Volume 1,
discusses bonding.  On page 33-2, for direct metal-to-metal bonds it
recommends:
*  8,300 kilopascals (1,200 pounds/square inch) pressure for soft
   metals.
*  Up to 10,300 kilopascals (1,500 pounds/square inch) pressure for
   hard metals.

Tables 33-1 and 33-2 on the same page give recommended torques for
metric machine screws/bolts from M3x0.5 through M10x1.25, and english
machine screws/bolts from #5-40 through 3/8-16.  These tables also give
the recommended maximum ampacity (current-carrying capacity) for single
and multiple wires connected by metal-to-metal compression bonds.

With 58 references for that chapter, I don't remember just where I found
this information originally, but I believe it was in several military
standards.

The most important factor is to have enough pressure (or scrubbing while
making contact) to break through oxides/sulfides/crud on the metal
surfaces, and to get the first few asperites to form contact dots.  Once
this has been achieved, the resistance drops much more slowly with
increasing pressure, mainly from a reduction in the constriction
resistance (distance that current must flow to travel through the
nearest contact dot).  And once contact has been made, we must maintain
sufficient pressure to maintain the contact dots.  Tin is a favorite
plating material for EMC shields, because it is soft and its oxide(s)
are fragile.  Thus a relatively-low pressure overall will give us stable
low-resistance electrical contact.

Figure 2 in
http://www.bita.org/datasheets/Accu-PT2008ContactResistance[1]-SE-LU.pdf
illustrates this effect for beryllium copper, tungsten, and palladium.

                John Barnes KS4GL, PE, NCE, ESDC Eng, SM IEEE
                dBi Corporation
                http://www.dbicorporation.com/


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