Carl Richards posted: >> Before I rush off back to development, I wondered if anyone in the group had any advice about implementing small areas of ground plane directly underneath oscillators ? I'm going to request upper and lower ground planes with via stitching between them and our internal groundplane. The oscillator is a 4pin plastic packaged device. Is there anything else or experience that anyone <<
Yes, it's the same as applying copper tape there -- if there is the same, direct path for current induced in the shield/tape to get back to the source. However, if you are putting Cu tape from the board to the chassis, that's a different barrel of monkeys; getting a consistent card-to-cage ground at high frequencies is not easy - and sometimes a card cage isn't a good ground, either, as you'll see if you model a shelf as a slot radiator. Cortland Richmond This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. Website: http://www.ieee-pses.org/ To post a message to the list, send your e-mail to [email protected] Instructions: http://listserv.ieee.org/listserv/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Ron Pickard: [email protected] Scott Douglas [email protected] For policy questions, send mail to: Richard Nute: [email protected] Jim Bacher: [email protected] All emc-pstc postings are archived and searchable on the web at: http://www.ieeecommunities.org/emc-pstc
