Doug,
 
For ITE:
 
1. You need to ensure complianceo of the  PCB/potting combination to the
requirements of 2.10.8 "Spacings Filled by Insulation Compound" of IEC60950-1.
 
2. You need to maintain a min. 0.4 mm distance between the SELV and primary
traces and comply with the dielectric strength test for reinforced insulation.
 
3. You need to maintain the min. V-1 flammability of the board assembly.
Remember that min. V-1 flammability board + min. V-1 flammability potting does
not ensure a min. V-1 fllammability of the combination board/potting. 
 
For other than ITE equipment:
 
Requirements are similar but may be different regardingh the distance through
insulation and flammability erquirements.
 
Regards,
 
Peter
 
 
 
Regards,
 
Peter
 
 


Doug Beckwith <[email protected]> wrote:

Hi Everyone,
A happy new year to you all.

Now for my question. I am looking at a unit that has mains and
SELV circuits that is encapsulated (potted). Am I correct in
assuming that creepage and clearance distances on the PCB for a
potted unit become the same as that for distance through
insulation, as when the traces are buried in a multilayer PCB?

Regards

Doug


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