Hello Expert,
 
I am facing some problem with Emmision from Ethernt port. 

case is that chassis groung and Signal ground are seperated by 0ohms

but still EMI radiation above the class A limit (40bd), and getting a big
spike (at 125MHz) upto 64bd..

1 )for chassis ground..
I have four holes on the board for assembly to chassis..
I am planning to use three holes to connect to signal ground while the last
hole(forth) connect to chasis ground of Ethernet jack.
 
do u think it imbalance the system..on PCB there is only one link(0ohms
resistor) between the signal groung and chassis ground..


2) somebody suggested to use external CM coil with RJ45 jack(which already
have internal magnetic with CM coil). and pull up on RX/TX -PN line with 50
Ohms to maintain the control impedence.
 
CM coil part #:acm2012e
http://www.tdk.co.jp/etvcl/spara/cmf.htm#ACM2012
<https://webmail.bolton.ac.uk/exchweb/b
n/redir.asp?URL=http://www.tdk.co.jp/etvcl/spara/cmf.htm%23ACM2012> 
 
with this coil they are claiming that it resolved the EMI issue..
but I am bit suspicious about this device due to following reasons:
1. only device supports  are USB and firewire only
2. USB differential Vpp = 0.400 while Ethernet supports Vpp=1v
 
If they remove the pullups from RX/TX signals with CM coil near the RJ
jack..then they cannot see any signal on the Ethernet port..
 
is it good practise to use two cM coils?
is this a right device to support the Ethernet std.?
 
 
thanks in advance,
Deepak

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