Peter,

Thanks for the paper (you sent me directly). It indeed shows
that EMC is most of the time about the unspecified, here in spice
models.
The spice model presented still does not include any environmental
parasitics...
Knowledge and experience provide us EMC-consultant with
an consistent view on what in reality happens, in addition to what
the designer tries to accomplish with his design.

All designers (but the RF specialists) overlook the third
connection to any circuit , the real earth ! 
(sometimes represented by a conductive enclosure)

Regards,

Ing. Gert Gremmen




ce-test, qualified testing bv



Van: Pete Perkins [mailto:[email protected]] 
Verzonden: Monday, December 22, 2008 1:42 AM
Aan: Gert Gremmen; [email protected]; 'Richard Nute'; 'John
Woodgate'
Onderwerp: FW: Thevenin equivalent circuit for SMPS emission sources -
issues

Gentlemen,

    Attached is the GDT modeling paper mentioned in the PSNet post.  

    I appreciate your insights and comments in all of this.  

Br, Pete

    Peter E Perkins, PE
    Principal Product Safety Engineer
    Tigard, Ore  97281-3427

    503/452-1201    fone/fax
    [email protected]


From: Pete Perkins [mailto:[email protected]]
Sent: Sunday, December 21, 2008 4:29 PM
To: 'John Woodgate'; '[email protected]'
Subject: RE: Thevenin equivalent circuit for SMPS emission sources -
issues

John & PSNet,

    The development of good models for components & circuits has been
underway for more than 100 years.  Simplification has been applied from
the beginning because of the additional work involved in solving the
needed equations as the complexity increased.  Thanx to the use of
modern digital computers it continues to get surprisingly easy to handle
complex models for
components or circuits.   

    Sometimes we're surprised as to how much complexity needs to be
included to better model the device to analyze the effects seen.  

    For instance, in the Nov 2008 IEEE Transactions on Electromagnetic
Compatibility there is a short letter 'Gas Discharge Tube Modeling with
PSpice' by Zola (Univ of Buenos Aires).  This describes a simple model
for use on PSpice programs run on desktops.  This model uses a double
transistor along with 4 other elements to describe the performance for
one polarity with the elements inverted for the opposite polarity.  The
bibliography contains a dozen references to similar models and modeling
techniques going back 15 years considered in developing this model.  

    My point is that developing the correct model to apply in any
situation is not trivial.  A simple model, if it describes the effects
seen, is the best.  If it doesn't exactly fit the situation then more
complexity needs to be added.  

    From my experience models are improved by adding in 'stray' elements
which have been left out for the last simplification.  

    The modeling of the FET in a SMPS may be adequate for using that
device in an operating circuit (I'm especially sure that it is if the
model has been developed by the manufacturer to help sell these devices
- as are the devices available in the SPICE that I use).  But, this may
not be adequate for issues outside the box which have not been
considered in the development of this model.  The model is an electrical
equivalent of the physical silicon and will be a simplification in many
ways.  It is not a direct simulation of the silicon physics operation.  

    Moving from one type of model to another is conceptually
straightforward but may lead to difficulties if the first model doesn't
properly take all of the details into account.  How many ways can we
describe a circuit with an input and an output?  The matrix models
include [A B C D], [H1 H2 H3 H4] parameters and maybe almost a dozen
more it seems.
All describe the same circuit but each view provides a different insight
into the innards and their operation.  

    This doesn't mean that we shouldn't try to get a better
understanding of the physics in detail and include that in the modeling.
It is best if the addition of elements for understanding are based upon
the physics of the device or upon the usual measurements which show the
need for additional elements.  

    So I am primarily looking at the measured data rather than trying to
develop a model to explain it.  I appreciate the others who are chasing
these model details; we need as much help as we can get to understand
this.


    Well, way too much for one quick post...  

    Br, Pete

    Peter E Perkins, PE
    Principal Product Safety Engineer
    Tigard, Ore  97281-3427

    503/452-1201    fone/fax
    [email protected]


    

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