In message 
<[email protected]>, dated 
Tue, 31 Aug 2010, N.Shani <[email protected]> writes:

>Hello all, not directly EMC affecting, rather (long term) reliability 
>concern: we received a PCN from one of our semiconductor suppliers that 
>effective immediately they will change the bond wire from gold to 
>copper, following industry trend.

There was an IEEE bulletin about this a few days ago.
>
>My immediate reaction was: What? Then, why? Is cost the only issue? 
>(and this brings me to the perennial issue of Pb-free assemblies and 
>how long will they last).
>
>Is anyone on this list aware of this sea change? I recall, from many 
>moons ago, that gold was deemed superior to anything else for most 
>semiconductor application.
>Aluminum (OK, Aluminium) was reserved for RF devices, but gold ruled 
>everything else (better conductivity, good plasticity or whatever term 
>needs to be used, etc).

Gold is not better than copper or silver in conductivity. The mechanical 
and metallurgical differences are more significant.
>
>Then, we started seeing copper as chip metalization of choice instead 
>of aluminum (conductivity?) or gold (cost?) - which made sense since it 
>was encapsulated in silicon dioxide. Now we are going to have copper 
>wire bonds. These are as low as 0.5 mil (12 um) in diameter... they'll 
>corrode in no time.

We can't assume that no-one has tested the use of copper bond wires. It 
would be reassuring  if the manufacturers released details of the 
successful tests and the stress levels applied.

Provided the encapsulating material has been carefully checked, there is 
no likelihood of a corrosion problem. Indeed, the use of gold does not 
eliminate the risk of unforeseen chemistry - some of us remember Purple 
Plague!
-- 
OOO - Own Opinions Only. Try www.jmwa.demon.co.uk and www.isce.org.uk
John Woodgate, J M Woodgate and Associates, Rayleigh, Essex UK
If at first you don't succeed, delegate.
But I support unbloated email http://www.asciiribbon.org/

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