Hi Steve,
 
I believe the link has become corrupt during copy/paste process.
 
Here is the link as copied from the registration site.
 
http://www.doubleknot.com/Registration/CalendarDetail.asp?ActivityKey=627742&OrgKey=861
 
Thanks,
Oscar


 
On Sun, Sep 13, 2009 at 11:49 PM, steve weir <[email protected]> wrote:


        Oscar are you sure those links are good? I get the message "
        We are unable to determine which organization you have come from. 
Please select your organization belo
        
        None of the organization calendars match.
        
        Best Regards,
        
        
        Steve
        
        Oscar Fallah wrote:
        

                Greetings,
                The IEEE SCV EMC Society is co-sponsoring an upcoming event 
with the SCV
                Components, Packaging and Management Technology(CPMT) Society:* 
*
                
                "Embedded Passives: Methodologies and Opportunities for 
Implementation"
                   -- John Savic, Cisco Systems *Thursday, September 24, 2009 *
                
                ·  Registration at 11:30 AM; Buffet lunch served from 11:45 - 
12:15 ($15 if
                reserved by Sept. 21; $20 at door; vegetarian available); 
presentation (no
                cost) at 12:15.
                
                Please register in advance for this event, using our *IEEE 
Council's
                DoubleKnot registration
                
                
site.*<http://www.doubleknot.com/Registration/CalendarDetail.asp?ActivityKeyb7742&OrgKey†1>
                
                
<http://www.doubleknot.com/Registration/CalendarDetail.asp?ActivityKeyb7742&OrgKey†1>
 


                You may register yourself, plus others from your 
company/institution, for
                the lunch and presentation, or the presentation only. You may 
make an *on-line
                
                payment* for the lunch, or arrange to *pay at the door*.
                
                
<http://www.cpmt.org/scv/meetings/biltmoremap.jpg><http://www.cpmt.org/scv/meetings/biltmoremap.jpg><http://www.cpmt.org/scv/meetings/biltmoremap.jpg>
                
                  - Please reserve in advance. We want to assure we have enough 
seating and 

                  food.
                  - By paying using our Doubleknot link, you are automatically 
registered
                  for the lunch and meeting.
                
                *LOCATION: Biltmore Hotel *
                   2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa 
Clara, (408)
                346-4620 -- click map at right.
                
                *OVERVIEW: *
                
                   Embedded Passives (EP) has evolved over the last several 
years,
                demonstrating value as a versatile means for enhancing the 
functionality of
                the PWB by improving circuit performance, simplifying assembly 
processes and
                enabling product miniaturization. The value of EP technology 
has been
                demonstrated in numerous RF and logic circuit designs by 
incorporating thin
                film decoupling capacitors as well as Polymer Thick Film (PTF) 
resistors.
                The full potential of EP has yet to be realized due to a 
cacophony of
                industry offerings and much-displaced initial expectations. 
Success in
                implementation depends on selecting the appropriate application 
and diligent
                trade-off analysis during the design stage. This discussion 
will highlight
                some mainstream EP technologies and demonstrate the value that 
was realized
                through various product implementations.
                
                * **Speaker Biography:*
                
                   *John Savic* was with Motorola for 16 years working on 
developing
                enabling technologies that enhance the functionality of 
HDI-PWB's. He holds
                numerous patents on HDI circuit and Embedded Passives (EP) 
manufacturing
                processes and has overseen the implementation of EP technology 
into over 80
                million cell phone products. Currently John is with Cisco 
Systems where he
                is responsible for the development and implementation of 
advanced substrate
                technologies for improving the performance of BGA packages for 
next
                generation ASIC applications.
                
                Direct Link:   http://www.cpmt.org/scv/meetings/cpmt0909l.html
                
                Society Link:  http://www.cpmt.org/scv/
                
                Cheers,
                
                Len – Secretary
                
                IEEE SCV EMC
                
                www.scvemc.org <http://www.scvemc.org/> 
                
                
                
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