Jim, as others have suggested, this is a pretty touch measurement to make with
any certainty using conventional means.

If the two modules are operational, it's possible to measure the HF voltage
difference between the two pieces of metal structure (or connection) with a
differential probe connected to a spectrum analyzer. You should be able to see
in real time any effects at reducing the bonding impedance.

If the bond in question is passive, you might try a transfer impedance
measurement such as used to measure EMI gaskets.

Regards, Ken


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On Jun 18, 2009, at 3:29 PM, Jim Hulbert wrote:


        
        What is an easy (and inexpensive) means of measuring the high frequency
chassis bond impedance between two modules of a system?  I would like to get
an impedance value at 500 MHz and 1 GHz.  
         
        Thanks.
         
        Jim Hulbert
        Pitney Bowes
         
         
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