Depending on the configuration, seems it would be practical to test the S21,
as suggested by Jim Knighten.
Since the OP is re: two modules, try a substitution method:
First, place the two modules in direct contact, at the bonding
points, making a “perfect” bond between the two. Measure S21.
This gives response of the path through the
two modules, when a perfect bond exists.
Next, replace the “prefect” bond with the real-world bond
of your system. Measure S21 again.
Any difference is due to bond.
Of course, the actual setup will be more difficult than can be
described in two sentences, but the concept is straight forward, and not
impossible.
Best Regards,
Patrick.
[email protected]
281-514-2259
From: [email protected] [mailto:[email protected]] On Behalf Of Jim Hulbert
Sent: Friday, June 19, 2009 7:44 AM
To: EMC-PSTC ([email protected])
Subject: RE: Chassis Bond Impedance Measurement
Thanks for your responses. I kind of knew the answer before I asked, but I
thought I'd give it a shot anyway.
Jim Hulbert, Team Leader
Compliance Engineering & Environmental Test
Systems Integration & Test / New Product Development Test
Tel: 203-924-3621 (442-3621)
From: [email protected] [mailto:[email protected]] On Behalf Of Jim Hulbert
Sent: Thursday, June 18, 2009 5:29 PM
To: EMC-PSTC ([email protected])
Subject: Chassis Bond Impedance Measurement
What is an easy (and inexpensive) means of measuring the high frequency
chassis bond impedance between two modules of a system? I would like to get
an impedance value at 500 MHz and 1 GHz.
Thanks.
Jim Hulbert
Pitney Bowes
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