A ground plane made of copper, brass or aluminum of any extent (width as well as length) will have microohms of resistance and the bonding requirement of 2.5 milliohms is reasonable. It typically requires a metal-to-metal faying surface bond (or wide bond strap) commensurate with low inductance, which is the real technical requirement enforced by the simple dc requirement.
Ken Javor Phone: (256) 650-5261 > From: John Woodgate <j...@jmwa.demon.co.uk> > Reply-To: John Woodgate <j...@jmwa.demon.co.uk> > Date: Fri, 13 Mar 2015 06:20:37 +0000 > To: <EMC-PSTC@LISTSERV.IEEE.ORG> > Subject: Re: [PSES] LISN Bonding to Ground Plane for CEMI Testing per ANSI > C63.4 > > In message > <OF24201270.2EDF97A3-ON85257E06.007BDBCE-85257E06.007D2D07@bureauveritas. > com>, dated Thu, 12 Mar 2015, Chris Bramley > <christopher.bram...@us.bureauveritas.com> writes: > >> ANSI C63.4-2014 clause 5.2.2 requires a direct current resistance of >> less than or equal to 2.5 milliohms between the LISN being used for >> CEMI measurements and the reference ground plane. > > It doesn't seem to me to be a very sensible requirement. For example, it > matters where on the LISN and where on the ground plane the resistance > is measured. Neither object is a superconductor! > > Is there a similarly stringent requirement for the resistance of the > ground plane between the LISN and the EUT? It seems to me that if that > is much higher than 2.5 mohms, the 2.5 mohms is not very important. > -- > OOO - Own Opinions Only. With best wishes. See www.jmwa.demon.co.uk > When I turn my back on the sun, it's to look for a rainbow > John Woodgate, J M Woodgate and Associates, Rayleigh, Essex UK > > - > ---------------------------------------------------------------- > This message is from the IEEE Product Safety Engineering Society emc-pstc > discussion list. To post a message to the list, send your e-mail to > <emc-p...@ieee.org> > > All emc-pstc postings are archived and searchable on the web at: > http://www.ieee-pses.org/emc-pstc.html > > Attachments are not permitted but the IEEE PSES Online Communities site at > http://product-compliance.oc.ieee.org/ can be used for graphics (in well-used > formats), large files, etc. > > Website: http://www.ieee-pses.org/ > Instructions: http://www.ieee-pses.org/list.html (including how to > unsubscribe) > List rules: http://www.ieee-pses.org/listrules.html > > For help, send mail to the list administrators: > Scott Douglas <sdoug...@ieee.org> > Mike Cantwell <mcantw...@ieee.org> > > For policy questions, send mail to: > Jim Bacher: <j.bac...@ieee.org> > David Heald: <dhe...@gmail.com> - ---------------------------------------------------------------- This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. To post a message to the list, send your e-mail to <emc-p...@ieee.org> All emc-pstc postings are archived and searchable on the web at: http://www.ieee-pses.org/emc-pstc.html Attachments are not permitted but the IEEE PSES Online Communities site at http://product-compliance.oc.ieee.org/ can be used for graphics (in well-used formats), large files, etc. Website: http://www.ieee-pses.org/ Instructions: http://www.ieee-pses.org/list.html (including how to unsubscribe) List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas <sdoug...@ieee.org> Mike Cantwell <mcantw...@ieee.org> For policy questions, send mail to: Jim Bacher: <j.bac...@ieee.org> David Heald: <dhe...@gmail.com>
