Dear all

I am explaining requirement of the standard. If this is OK or not I cannot 
judge, You can go back to TC108 and complain if this is not OK.

Same rule was also in 60950-1 standard.

I can confirm that many many manufacturers of worldwide known PSU manufacturers 
are regularly use this approach to reduce required distances in inner layers. 
UL now has also such program for cemented joint testing.

Best regards
Bostjan



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________________________________
From: Ralph McDiarmid <[email protected]>
Sent: Wednesday, November 6, 2024 9:50:46 PM
To: [email protected] <[email protected]>
Subject: Re: [PSES] SV: [PSES] Creepage Live-Ground


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I agree with John.  A PCB should not be assumed as equivalent to void-free 
solid insulation.



Ralph



From: John Woodgate <[email protected]>
Sent: November 6, 2024 1:41 PM
To: [email protected]
Subject: Re: [PSES] SV: [PSES] Creepage Live-Ground



I'm not sure. I considered the possibility that in making the PCB, the bonding 
of the top layer to the ground plane layer might be faulty, creating an air gap 
between surfaces that are, or might be, conductive. That is why I recommended 
as much creepage distance as possible.

On 2024-11-06 21:27, Richard Nute wrote:

Depending on the PCB fabrication, I would expect this construction to be solid 
insulation from the 230VAC to the ground plane.  Such construction has no 
clearance or creepage.

--

OOO - Own Opinions Only

Best Wishes

John Woodgate

Keep trying



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