Just got that via NASA Tech Briefs: http://www.mdatechnology.net/update/article.asp?id=4102 respectively http://www.eiclabs.com/
Maybe perfect for stage separation and other release mechanisms . . depending how fast the release will be (they mention > 1 sec) Bruno -- Bruno Berger Swiss Propulsion Laboratory E-Mail: [EMAIL PROTECTED] WWW: http://www.spl.ch HAM: HB9RSU Quoting: TECHNOLOGY NEWS The disassembly process can be a complex and chaotic process involving systems of latches, bolts, and other fasteners, the use of hammers and torches, and many times the partial or complete destruction of equipment components. EIC Laboratories (Norwood, MA) has developed an electrically disbonding adhesive mechanism to simplify the disassembly process. ElectRelease(tm) includes a high-strength epoxy sandwiched between metal substrates. The epoxy can support more than 2,000 pounds per square inch. Applying between 10 and 50 volts of electricity to the mechanism causes the epoxy to disbond, cleaving the "sandwich" into two pieces (one clean substrate and one substrate with the epoxy still attached). MDA's (Missile Defense Agency) predecessor, BMDO, funded EIC's technology for potential use as a release mechanism in launch vehicles. EIC anticipates commercial opportunities for the technology throughout the Department of Defense and NASA, as well as in private-sector launch vehicles and satellites. _______________________________________________ ERPS-list mailing list [EMAIL PROTECTED] http://lists.erps.org/mailman/listinfo/erps-list
