https://bugzilla.redhat.com/show_bug.cgi?id=1094015



--- Comment #23 from Cheng-Chia Tseng <[email protected]> ---
Hi, I am working on 0.4 version today, and I will upload the spec and SRPM
tomorrow.

As for the sponsorship, I find I don't have much free time working on packaging
after my new job since August. Maybe I will apply that after being used to my
new job and having more free time. :P

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